EP2SGX60EF1152I3N vs EP2SGX60EF1152C3 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX60EF1152I3N disebabkan oleh Intel dan EP2SGX60EF1152C3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP2SGX60EF1152C3 - Stratix II GX FPGA 60K LE 1152-FBGA | Intel
EP2SGX60EF1152C3 ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP2SGX60EF1152I3N | EP2SGX60EF1152C3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Masa Terakhir Dibeli |
| Family | Stratix II GX | — |
| Device Type | Field-Programmable Gate Array (FPGA) | — |
| Logic Elements (LEs) | 60,440 | — |
| Configurable Logic Blocks (CLBs) | 60,440 | — |
| Embedded Memory Bits | 2,544,192 bits | — |
| Internal Frequency (max) | 717 MHz | — |
| Process Technology | 90 nm | 90 nm |
| Core Voltage | 1.2 V | 1.2 V |
| Package Type | 1152-ball FC-FBGA | — |
| Package Size | 35 x 35 mm (1 mm ball pitch) | — |
| Number of Terminals | 1152 | — |
| Terminal Form | Ball | — |
| Temperature Grade | Industrial (-40C to +100C junction) | — |
| Lead-Free | Yes | Yes |
| Status RoHS | Compliant | Compliant |
| Aras MSL | [DATA_NEEDED: MSL level] | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Device Family | — | Stratix II GX |
| Logic Elements | — | 60,440 |
| LABs / CLBs | — | 3,022 |
| User I/Os | — | 534 |
| Total Memory Bits | — | 2,544,192 |
| Number of Transceivers | — | 36 |
| Maximum Transceiver Data Rate | — | 6.375 Gbps |
| Internal Frequency | — | 717 MHz |
| Propagation Delay | — | [DATA_NEEDED: propagation delay ns] |
| Multipliers (18x18) | — | 252 |
| Kemasan | — | 1152-ball FC-FBGA (35 x 35 mm) |
| Suhu Operasi | — | 0C to +85C (Commercial, C3 suffix) |
| Configuration Memory Interface | — | EPCS serial configuration devices |