EP2SGX60EF1152I3N vs EP2SGX60EF1152C3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX60EF1152I3N sa pamamagitan ng Intel at EP2SGX60EF1152C3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2SGX60EF1152C3 - Stratix II GX FPGA 60K LE 1152-FBGA | Intel
EP2SGX60EF1152C3 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP2SGX60EF1152I3N | EP2SGX60EF1152C3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Huling Pagbili |
| Family | Stratix II GX | — |
| Device Type | Field-Programmable Gate Array (FPGA) | — |
| Logic Elements (LEs) | 60,440 | — |
| Configurable Logic Blocks (CLBs) | 60,440 | — |
| Embedded Memory Bits | 2,544,192 bits | — |
| Internal Frequency (max) | 717 MHz | — |
| Process Technology | 90 nm | 90 nm |
| Core Voltage | 1.2 V | 1.2 V |
| Package Type | 1152-ball FC-FBGA | — |
| Package Size | 35 x 35 mm (1 mm ball pitch) | — |
| Number of Terminals | 1152 | — |
| Terminal Form | Ball | — |
| Temperature Grade | Industrial (-40C to +100C junction) | — |
| Lead-Free | Yes | Yes |
| Tindminan RoHS | Compliant | Compliant |
| Level ng MSL | [DATA_NEEDED: MSL level] | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Device Family | — | Stratix II GX |
| Logic Elements | — | 60,440 |
| LABs / CLBs | — | 3,022 |
| User I/Os | — | 534 |
| Total Memory Bits | — | 2,544,192 |
| Number of Transceivers | — | 36 |
| Maximum Transceiver Data Rate | — | 6.375 Gbps |
| Internal Frequency | — | 717 MHz |
| Propagation Delay | — | [DATA_NEEDED: propagation delay ns] |
| Multipliers (18x18) | — | 252 |
| Packhaging | — | 1152-ball FC-FBGA (35 x 35 mm) |
| Temperature na Operasyon | — | 0C to +85C (Commercial, C3 suffix) |
| Configuration Memory Interface | — | EPCS serial configuration devices |