EP2SGX90EF1152C4N vs EP2SGX90EF1152C3ES Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX90EF1152C4N disebabkan oleh Intel dan EP2SGX90EF1152C3ES disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP2SGX90EF1152C4N - Stratix II GX FPGA, 90960 LE, 1152-FBGA | Intel
EP2SGX90EF1152C4N ⚠ Bahagian terakhir untuk beliIntel
EP2SGX90EF1152C3ES - Stratix II GX FPGA 90nm 558 I/O 1152-BBGA | Intel
EP2SGX90EF1152C3ES ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP2SGX90EF1152C4N | EP2SGX90EF1152C3ES |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Masa Terakhir Dibeli |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements (LE) | 90,960 | — |
| LABs/CLBs | 4,548 | — |
| Total RAM Bits | 4,520,448 bits | — |
| User I/O Count | 558 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Core Voltage | 1.2 V | 1.5 V (Enhanced, 'E' suffix) |
| Process Node | 90 nm | 90 nm |
| Transceivers | Up to 20 channels, 6.375 Gbps per channel | — |
| Speed Grade | C4 | C3 |
| Suhu Operasi | Commercial (0C to +85C) | — |
| Kemasan | 1152-BBGA / FC-FBGA-1152 | 1152-BBGA (FineLine BGA, 35x35 mm) |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Aras MSL | MSL-3 / MS-034AAR-1 (per package outline) | — |
| Lead-Free / RoHS | Lead free; RoHS compliance per JEDEC | — |
| Logic Elements | — | 90,960 |
| Embedded Memory | — | 4,520,448 bits (approx. 4.5 Mbit) |
| User I/O Pins | — | 558 |
| Temperature Grade | — | Commercial Extended (-40 C to +100 C) |
| High-Speed Transceivers | — | Up to 12 channels (per Stratix II GX family) |
| Transceiver Data Rate | — | Up to 6.375 Gbps per channel (family spec) |
| DSP Blocks | — | Yes, dedicated 18x18 multipliers and accumulators |
| PLL Count | — | [DATA_NEEDED: PLL count for EP2SGX90 variant] |
| User I/O Banks | — | 24 (per package datasheet) |
| Configuration | — | SRAM-based, supports Fast Passive Parallel, Fast Active Serial, JTAG |
| Status RoHS | — | Compliant |
| Lead-Free | — | Yes |