EP3C25F324I7 vs EP3C16F484I7 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C25F324I7 disebabkan oleh Intel dan EP3C16F484I7 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3C25F324I7 | EP3C16F484I7 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Aktif |
| Series | Cyclone III | — |
| Logic Elements (LEs) | 24,624 | — |
| Logic Array Blocks (LABs) | 1,539 | 963 |
| Embedded Memory | 608,256 bits (594 Kbits M9K blocks) | — |
| Embedded 18x18 Multipliers | 66 | 56 |
| PLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Maximum User I/O | 215 | — |
| Process Technology | TSMC 65 nm low-power CMOS | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V (per bank) | — |
| Suhu Hubungan Operasi | -40 °C to +100 °C (industrial) | — |
| Kemasan | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch | 484-ball FineLine BGA (F484) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Configuration Modes | Passive Serial (PS), Active Serial (AS), JTAG | — |
| Status RoHS | Compliant | Compliant |
| Family | — | Cyclone III |
| Manufacturer | — | Intel (formerly Altera) |
| Logic Elements | — | 15,408 |
| Total Embedded Memory | — | 516,096 bits (63 KB) |
| Embedded Memory Blocks | — | M9K x 56 |
| User I/Os | — | 346 |
| General-Purpose PLLs | — | 4 |
| Suhu Operasi | — | -40C to +100C (industrial) |
| Speed Grade | — | 7 (fastest commercial/industrial) |
| Process Node | — | 60 nm TSMC low-power |
| Configuration Method | — | Passive Serial, Fast Passive Parallel, Active Serial, JTAG |