EP3C25F324I7 vs EP3C16F484I7 比較

詳細並排比較 EP3C25F324I7 由 Intel 與 EP3C16F484I7 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3C25F324I7 EP3C16F484I7
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 NRND 啟用中
Series Cyclone III —
Logic Elements (LEs) 24,624 —
Logic Array Blocks (LABs) 1,539 963
Embedded Memory 608,256 bits (594 Kbits M9K blocks) —
Embedded 18x18 Multipliers 66 56
PLLs 4 —
Global Clock Networks 20 —
Maximum User I/O 215 —
Process Technology TSMC 65 nm low-power CMOS —
Core Voltage (VCCINT) 1.2 V —
I/O Voltage (VCCIO) 1.2 V to 3.3 V (per bank) —
工作接面溫度 -40 °C to +100 °C (industrial) —
封裝 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch 484-ball FineLine BGA (F484)
安裝類型 Surface Mount Surface Mount
Configuration Modes Passive Serial (PS), Active Serial (AS), JTAG —
RoHS 狀態 Compliant Compliant
Family — Cyclone III
Manufacturer — Intel (formerly Altera)
Logic Elements — 15,408
Total Embedded Memory — 516,096 bits (63 KB)
Embedded Memory Blocks — M9K x 56
User I/Os — 346
General-Purpose PLLs — 4
工作溫度 — -40C to +100C (industrial)
Speed Grade — 7 (fastest commercial/industrial)
Process Node — 60 nm TSMC low-power
Configuration Method — Passive Serial, Fast Passive Parallel, Active Serial, JTAG

資料表與資源

瀏覽所有產品 建立 BOM 索取報價