EP3C25F324I7 vs EP3C16F484I7 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3C25F324I7 sa pamamagitan ng Intel at EP3C16F484I7 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3C25F324I7 EP3C16F484I7
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND Aktibo
Series Cyclone III —
Logic Elements (LEs) 24,624 —
Logic Array Blocks (LABs) 1,539 963
Embedded Memory 608,256 bits (594 Kbits M9K blocks) —
Embedded 18x18 Multipliers 66 56
PLLs 4 —
Global Clock Networks 20 —
Maximum User I/O 215 —
Process Technology TSMC 65 nm low-power CMOS —
Core Voltage (VCCINT) 1.2 V —
I/O Voltage (VCCIO) 1.2 V to 3.3 V (per bank) —
Temperature ng Junction na Operasyon -40 °C to +100 °C (industrial) —
Packhaging 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch 484-ball FineLine BGA (F484)
Uri ng Pagpapasok Surface Mount Surface Mount
Configuration Modes Passive Serial (PS), Active Serial (AS), JTAG —
Tindminan RoHS Compliant Compliant
Family — Cyclone III
Manufacturer — Intel (formerly Altera)
Logic Elements — 15,408
Total Embedded Memory — 516,096 bits (63 KB)
Embedded Memory Blocks — M9K x 56
User I/Os — 346
General-Purpose PLLs — 4
Temperature na Operasyon — -40C to +100C (industrial)
Speed Grade — 7 (fastest commercial/industrial)
Process Node — 60 nm TSMC low-power
Configuration Method — Passive Serial, Fast Passive Parallel, Active Serial, JTAG

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