EP3C40F780C7N vs EP3C40F780C6N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C40F780C7N disebabkan oleh Intel dan EP3C40F780C6N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3C40F780C7N | EP3C40F780C6N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Family | Cyclone III | Cyclone III |
| Logic Elements | 39,600 LE | 39,600 |
| Total RAM Bits | 1,161,216 bits | — |
| Embedded Multipliers | 126 (18x18) | — |
| User I/Os | 535 | — |
| Kemasan | 780-ball FBGA (FineLine BGA) | 780-ball FBGA (FineLine BGA) |
| Speed Grade | 7 (C7, commercial) | 6 (commercial) |
| Process Node | 65 nm TSMC low-power | — |
| Suhu Operasi | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Supply Voltage (Core) | 1.2 V | — |
| Configuration Method | JTAG, Active Serial, Passive Serial | SRAM, JTAG via USB-Blaster |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | — |
| Lead-Free / RoHS | Yes (N suffix) | — |
| Moisture Sensitivity Level | MSL3 (per J-STD-020) | — |
| Embedded Memory Bits | — | 1,161,216 |
| Embedded Memory (Kbytes) | — | 113 |
| M9K Memory Blocks | — | 126 |
| Logic Array Blocks (LABs) | — | 4,065 |
| Maximum User I/O Pins | — | 535 |
| Process Technology | — | 60 nm CMOS |
| Core Voltage | — | 1.2 V |
| Package Dimensions | — | 29 x 29 mm |
| Ball Pitch | — | 1.0 mm |
| Package Height | — | 2.6 mm |
| Jenis Pemasangan | — | Surface Mount (FBGA) |
| Lead Free | — | Yes |
| Status RoHS | — | Compliant |