EP3C40F780C7N vs EP3C40F780C6N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C40F780C7N sa pamamagitan ng Intel at EP3C40F780C6N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C40F780C7N | EP3C40F780C6N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Family | Cyclone III | Cyclone III |
| Logic Elements | 39,600 LE | 39,600 |
| Total RAM Bits | 1,161,216 bits | — |
| Embedded Multipliers | 126 (18x18) | — |
| User I/Os | 535 | — |
| Packhaging | 780-ball FBGA (FineLine BGA) | 780-ball FBGA (FineLine BGA) |
| Speed Grade | 7 (C7, commercial) | 6 (commercial) |
| Process Node | 65 nm TSMC low-power | — |
| Temperature na Operasyon | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Supply Voltage (Core) | 1.2 V | — |
| Configuration Method | JTAG, Active Serial, Passive Serial | SRAM, JTAG via USB-Blaster |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | — |
| Lead-Free / RoHS | Yes (N suffix) | — |
| Moisture Sensitivity Level | MSL3 (per J-STD-020) | — |
| Embedded Memory Bits | — | 1,161,216 |
| Embedded Memory (Kbytes) | — | 113 |
| M9K Memory Blocks | — | 126 |
| Logic Array Blocks (LABs) | — | 4,065 |
| Maximum User I/O Pins | — | 535 |
| Process Technology | — | 60 nm CMOS |
| Core Voltage | — | 1.2 V |
| Package Dimensions | — | 29 x 29 mm |
| Ball Pitch | — | 1.0 mm |
| Package Height | — | 2.6 mm |
| Uri ng Pagpapasok | — | Surface Mount (FBGA) |
| Lead Free | — | Yes |
| Tindminan RoHS | — | Compliant |