EP3C5U256C8 vs EP3C5U256C8N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C5U256C8 disebabkan oleh Intel dan EP3C5U256C8N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3C5U256C8 | EP3C5U256C8N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Cyclone® III | Cyclone III |
| Logic Elements | 5,136 | — |
| Total Memory Bits | 423,936 | — |
| Number of Logic Array Blocks (LABs) | 182 | — |
| Number of I/O Pins | 182 (maximum user I/O) | — |
| Embedded 18x18 Multipliers | 23 | — |
| PLLs | 2 | — |
| Kemasan | 256-LFBGA (UBGA) | 256-UBGA (Ultra FineLine BGA) |
| Package Code | LFBGA-256, 17x17 mm | — |
| Speed Grade | 8 (commercial) | 8 (commercial) |
| Suhu Operasi | 0C to +85C (commercial grade) | 0C to +85C (commercial, "C" suffix) |
| Core Voltage | 1.0 V to 1.2 V (1.2 V nominal) | — |
| I/O Voltage Support | LVDS, LVCMOS, SSTL, HSTL | — |
| Configuration Modes | JTAG, Active Serial, Active Parallel, Passive Serial | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant | — |
| Process Technology | 60 nm low-power CMOS | 60 nm CMOS, SRAM-based configuration |
| Family Name | — | Cyclone® III |
| Logic Elements (LE) | — | 5,136 |
| Number of CLBs | — | 5,136 |
| Number of Logic Cells | — | 5,136 |
| Total RAM Bits | — | 423,936 |
| Number of I/O | — | 182 |
| Tegangan Pemberi Arus | — | 1.2 V core, 1.2-3.3 V I/O |
| Number of Embedded Multipliers (18x18) | — | 46 |
| Number of PLLs | — | 4 |
| Maximum Operating Frequency | — | [DATA_NEEDED: maximum operating frequency] |
| Package Dimensions | — | 14 x 14 mm, 0.8 mm ball pitch |
| Lead Free / RoHS | — | Lead Free, RoHS Compliant |