EP3CLS70F780C8 vs EP3CLS150F780C8 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3CLS70F780C8 disebabkan oleh Intel dan EP3CLS150F780C8 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3CLS70F780C8 | EP3CLS150F780C8 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone III LS | Cyclone III LS |
| Logic Elements (LE) | 70,208 | — |
| Logic Array Blocks (LAB) | 4,463 | — |
| Embedded Memory Bits | 3,068,928 bit | — |
| Embedded Memory (M9K blocks) | 305 | — |
| Embedded 18x18 Multipliers | 244 | — |
| Maximum User I/O Pins | 413 | — |
| Maximum Operating Frequency | 402 MHz | 402 MHz |
| Process Technology | 65 nm TSMC low-power CMOS | 65 nm |
| Core Supply Voltage | 1.2 V | 1.2 V |
| Kemasan | 780-ball FineLine BGA (FBGA-780) | — |
| Suhu Hubungan Operasi | 0 °C to +85 °C (commercial) | — |
| PLLs | 4 general-purpose PLLs | — |
| Global Clock Networks | 20 | — |
| Security Features | AES bitstream encryption, JTAG tamper protection | — |
| Configuration Scheme | Active serial (AS), passive serial (PS), JTAG, Fast Passive Parallel (FPP) | — |
| Status RoHS | Compliant | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Series | — | Cyclone III |
| Logic Elements / Cells | — | 150,848 |
| Total Memory Bits | — | 6,137,856 |
| Number of LABs | — | 9,428 |
| Number of Logic Array Blocks | — | 9,428 |
| User I/O Pins | — | 413 |
| Number of PLLs | — | 4 |
| Suhu Operasi | — | 0 C to 85 C (Commercial) |
| Package Type | — | FBGA-780 |
| Package Dimensions | — | 29 x 29 mm |
| Ball Pitch | — | 1.0 mm |
| Lead Free / RoHS | — | Compliant |
| Configuration Mode | — | JTAG, Passive Serial, Active Serial, Fast Passive Parallel |