EP3CLS70F780C8 vs EP3CLS150F780C8 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3CLS70F780C8 sa pamamagitan ng Intel at EP3CLS150F780C8 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3CLS70F780C8 | EP3CLS150F780C8 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone III LS | Cyclone III LS |
| Logic Elements (LE) | 70,208 | — |
| Logic Array Blocks (LAB) | 4,463 | — |
| Embedded Memory Bits | 3,068,928 bit | — |
| Embedded Memory (M9K blocks) | 305 | — |
| Embedded 18x18 Multipliers | 244 | — |
| Maximum User I/O Pins | 413 | — |
| Maximum Operating Frequency | 402 MHz | 402 MHz |
| Process Technology | 65 nm TSMC low-power CMOS | 65 nm |
| Core Supply Voltage | 1.2 V | 1.2 V |
| Packhaging | 780-ball FineLine BGA (FBGA-780) | — |
| Temperature ng Junction na Operasyon | 0 °C to +85 °C (commercial) | — |
| PLLs | 4 general-purpose PLLs | — |
| Global Clock Networks | 20 | — |
| Security Features | AES bitstream encryption, JTAG tamper protection | — |
| Configuration Scheme | Active serial (AS), passive serial (PS), JTAG, Fast Passive Parallel (FPP) | — |
| Tindminan RoHS | Compliant | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Series | — | Cyclone III |
| Logic Elements / Cells | — | 150,848 |
| Total Memory Bits | — | 6,137,856 |
| Number of LABs | — | 9,428 |
| Number of Logic Array Blocks | — | 9,428 |
| User I/O Pins | — | 413 |
| Number of PLLs | — | 4 |
| Temperature na Operasyon | — | 0 C to 85 C (Commercial) |
| Package Type | — | FBGA-780 |
| Package Dimensions | — | 29 x 29 mm |
| Ball Pitch | — | 1.0 mm |
| Lead Free / RoHS | — | Compliant |
| Configuration Mode | — | JTAG, Passive Serial, Active Serial, Fast Passive Parallel |