EP3SE110F1152C4 vs EP3SE110F1152C2 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE110F1152C4 disebabkan oleh Intel dan EP3SE110F1152C2 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SE110F1152C4 - Stratix III E FPGA 107.5K LE 1152-FCBGA | Intel
EP3SE110F1152C4 ⚠ Bahagian terakhir untuk beliIntel
EP3SE110F1152C2 - Stratix III E FPGA, 107K LE, 1152-FCBGA | Intel
EP3SE110F1152C2 ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP3SE110F1152C4 | EP3SE110F1152C2 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Masa Terakhir Dibeli |
| Family | Stratix III E | Stratix III E (Enhanced) |
| Logic Elements | 107,500 | 107,500 |
| Embedded Memory | 8,936,448 bits | — |
| Maximum User I/Os | 744 | 744 |
| DSP Blocks | [DATA_NEEDED: 18x18 multiplier count] | — |
| Logic Array Blocks (LABs) | [DATA_NEEDED: LAB count] | 4,300 |
| Process Technology | 65 nm | 65 nm |
| Core Voltage | 1.1 V | 0.9 V |
| Maximum Performance | 450 MHz | — |
| Package Type | 1152-ball FCBGA (Flip-Chip BGA) | — |
| Operating Temperature Grade | Commercial (C4) | — |
| Configuration Memory | SRAM-based (volatile) | — |
| On-chip Termination | Dynamic, programmable | — |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, HSTL, SSTL | — |
| Status RoHS | Compliant | — |
| Adaptive Logic Modules (ALMs) | — | 53,750 |
| Embedded Memory (bits) | — | 8,936,448 |
| Maximum Internal Frequency | — | 800 MHz |
| Suhu Operasi | — | 0C to 85C (Commercial) |
| Kemasan | — | 1152-ball FC-BGA |
| Package Code | — | F1152 |
| Jenis Pemasangan | — | Surface Mount (BGA) |
| Device Type | — | FPGA |
| Configuration | — | SRAM-based, volatile (requires configuration device) |