EP3SE110F1152C4 vs EP3SE110F1152C2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE110F1152C4 sa pamamagitan ng Intel at EP3SE110F1152C2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE110F1152C4 - Stratix III E FPGA 107.5K LE 1152-FCBGA | Intel
EP3SE110F1152C4 ⚠ Huling PagbiliIntel
EP3SE110F1152C2 - Stratix III E FPGA, 107K LE, 1152-FCBGA | Intel
EP3SE110F1152C2 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SE110F1152C4 | EP3SE110F1152C2 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Huling Pagbili |
| Family | Stratix III E | Stratix III E (Enhanced) |
| Logic Elements | 107,500 | 107,500 |
| Embedded Memory | 8,936,448 bits | — |
| Maximum User I/Os | 744 | 744 |
| DSP Blocks | [DATA_NEEDED: 18x18 multiplier count] | — |
| Logic Array Blocks (LABs) | [DATA_NEEDED: LAB count] | 4,300 |
| Process Technology | 65 nm | 65 nm |
| Core Voltage | 1.1 V | 0.9 V |
| Maximum Performance | 450 MHz | — |
| Package Type | 1152-ball FCBGA (Flip-Chip BGA) | — |
| Operating Temperature Grade | Commercial (C4) | — |
| Configuration Memory | SRAM-based (volatile) | — |
| On-chip Termination | Dynamic, programmable | — |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, HSTL, SSTL | — |
| Tindminan RoHS | Compliant | — |
| Adaptive Logic Modules (ALMs) | — | 53,750 |
| Embedded Memory (bits) | — | 8,936,448 |
| Maximum Internal Frequency | — | 800 MHz |
| Temperature na Operasyon | — | 0C to 85C (Commercial) |
| Packhaging | — | 1152-ball FC-BGA |
| Package Code | — | F1152 |
| Uri ng Pagpapasok | — | Surface Mount (BGA) |
| Device Type | — | FPGA |
| Configuration | — | SRAM-based, volatile (requires configuration device) |