EP3SE110F1152C4 vs EP3SE110F1152C4N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE110F1152C4 disebabkan oleh Intel dan EP3SE110F1152C4N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SE110F1152C4 - Stratix III E FPGA 107.5K LE 1152-FCBGA | Intel
EP3SE110F1152C4 ⚠ Bahagian terakhir untuk beliIntel
EP3SE110F1152C4N - Stratix III E FPGA, 107.5K LE, 1152-FCBGA | Intel
EP3SE110F1152C4N ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP3SE110F1152C4 | EP3SE110F1152C4N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Masa Terakhir Dibeli |
| Family | Stratix III E | Stratix III Enhanced (E) |
| Logic Elements | 107,500 | 107,500 |
| Embedded Memory | 8,936,448 bits | — |
| Maximum User I/Os | 744 | — |
| DSP Blocks | [DATA_NEEDED: 18x18 multiplier count] | — |
| Logic Array Blocks (LABs) | [DATA_NEEDED: LAB count] | 4300 |
| Process Technology | 65 nm | 65 nm |
| Core Voltage | 1.1 V | 1.1 V |
| Maximum Performance | 450 MHz | — |
| Package Type | 1152-ball FCBGA (Flip-Chip BGA) | — |
| Operating Temperature Grade | Commercial (C4) | — |
| Configuration Memory | SRAM-based (volatile) | — |
| On-chip Termination | Dynamic, programmable | — |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, HSTL, SSTL | — |
| Status RoHS | Compliant | Compliant |
| Memory Bits | — | 8,936,448 |
| Embedded Multipliers (18x18) | — | 896 |
| User I/O Pins | — | 744 |
| Maximum Operating Frequency | — | 450 MHz |
| Kemasan | — | 1152-ball FCBGA (Flip-Chip BGA) |
| Jenis Pemasangan | — | Surface Mount |
| Suhu Operasi | — | 0C to +85C (Commercial) |
| Configuration Method | — | Passive Serial / Fast Passive Parallel / JTAG / AES-256 |
| Aras MSL | — | 3 (168 hours) |
| Design Software | — | Quartus II (v9.1 or later) |