EP3SE110F1152C4 vs EP3SE110F1152C4N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE110F1152C4 sa pamamagitan ng Intel at EP3SE110F1152C4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE110F1152C4 - Stratix III E FPGA 107.5K LE 1152-FCBGA | Intel
EP3SE110F1152C4 ⚠ Huling PagbiliIntel
EP3SE110F1152C4N - Stratix III E FPGA, 107.5K LE, 1152-FCBGA | Intel
EP3SE110F1152C4N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SE110F1152C4 | EP3SE110F1152C4N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Huling Pagbili |
| Family | Stratix III E | Stratix III Enhanced (E) |
| Logic Elements | 107,500 | 107,500 |
| Embedded Memory | 8,936,448 bits | — |
| Maximum User I/Os | 744 | — |
| DSP Blocks | [DATA_NEEDED: 18x18 multiplier count] | — |
| Logic Array Blocks (LABs) | [DATA_NEEDED: LAB count] | 4300 |
| Process Technology | 65 nm | 65 nm |
| Core Voltage | 1.1 V | 1.1 V |
| Maximum Performance | 450 MHz | — |
| Package Type | 1152-ball FCBGA (Flip-Chip BGA) | — |
| Operating Temperature Grade | Commercial (C4) | — |
| Configuration Memory | SRAM-based (volatile) | — |
| On-chip Termination | Dynamic, programmable | — |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, HSTL, SSTL | — |
| Tindminan RoHS | Compliant | Compliant |
| Memory Bits | — | 8,936,448 |
| Embedded Multipliers (18x18) | — | 896 |
| User I/O Pins | — | 744 |
| Maximum Operating Frequency | — | 450 MHz |
| Packhaging | — | 1152-ball FCBGA (Flip-Chip BGA) |
| Uri ng Pagpapasok | — | Surface Mount |
| Temperature na Operasyon | — | 0C to +85C (Commercial) |
| Configuration Method | — | Passive Serial / Fast Passive Parallel / JTAG / AES-256 |
| Level ng MSL | — | 3 (168 hours) |
| Design Software | — | Quartus II (v9.1 or later) |