EP3SE110F780C3N vs EP3SE110F780C4L Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE110F780C3N disebabkan oleh Intel dan EP3SE110F780C4L disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP3SE110F780C3N EP3SE110F780C4L
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Family Stratix III E —
Logic Elements (LEs) 107,500 —
Embedded Memory Bits 8,936,448 —
Logic Array Blocks (LABs) 4,300 —
User I/Os 488 —
Kemasan 780-ball FCBGA (Flip-Chip BGA) —
Core Voltage 1.1 V —
Process Technology 65 nm 65 nm CMOS
Maximum Operating Frequency 500 MHz —
DSP Blocks Yes (integrated, count varies by configuration) —
Transceiver Channels 8 (multi-gigabit) —
Embedded Memory TriMatrix (MLAB + M9K + M144K) —
Configuration Method Serial / Parallel via Quartus II —
Operating Temperature Grade Commercial (C suffix) —
Status RoHS Compliant Compliant
Jenis Pemasangan Surface Mount (BGA) Surface Mount
Aras MSL [DATA_NEEDED: MSL rating] 3 (per JEDEC J-STD-020)
Series — Stratix III E
Number of Logic Elements (LE) — 107,500
Number of Logic Array Blocks (LAB) — [DATA_NEEDED: number of LABs]
Total Memory Bits — 8,936,448 bits
Number of 18x18 Multipliers — 488
Number of PLLs — [DATA_NEEDED: PLL count]
User I/O Pins — 488
Speed Grade — -4 (commercial)
Process Variant — L (low-leakage)
Suhu Operasi — 0C to +85C (commercial)
Supply Voltage (Core) — [DATA_NEEDED: core voltage]
Package Type — 780-Ball FCBGA
Ball Pitch — 1.0 mm

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