EP3SE260F1152C4LN vs EP3SE260F1152C4N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260F1152C4LN disebabkan oleh Intel dan EP3SE260F1152C4N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SE260F1152C4LN - Stratix III E FPGA 255K LE 1152-FCBGA | Intel
EP3SE260F1152C4LN ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP3SE260F1152C4LN | EP3SE260F1152C4N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Obsolete |
| Family | Stratix III E | Stratix III (Enhanced) |
| Logic Elements (LE) | 255,000 | — |
| Embedded Memory | 16,672,768 bits | 16,672,768 bits (16.67 Mbit) |
| Logic Array Blocks (LABs) | 10,200 | — |
| User I/Os | 744 | — |
| Kemasan | 1152-ball FC-BGA | 1152-ball FC-FBGA (flip-chip) |
| Process Technology | 65 nm CMOS | 65 nm CMOS |
| Core Voltage | 0.9 V | 1.1 V |
| Core Clock Speed | 375 MHz (max) | — |
| Transceiver Data Rate | 717 MHz | — |
| Speed Grade | C4 | -4 (commercial temperature) |
| Suhu Operasi | 0C to +85C (commercial) | 0C to +85C (commercial, 'C' suffix) |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Aras MSL | [DATA_NEEDED: MSL level] | — |
| Status RoHS | Compliant | — |
| Series | — | Stratix III E |
| Logic Elements (LEs) | — | 255,000 |
| Maximum User I/Os | — | 744 |
| Number of LABs/CLBs | — | 10,200 |
| DSP / 18x18 Multipliers | — | 768 embedded multipliers |
| Maximum Operating Frequency | — | 450 MHz |
| Packaging | — | Tray |
| Lead-Free / RoHS | — | Lead-free finish (RoHS compliant per distributor listing) |
| Jenis Ingatan | — | SRAM-based, volatile (requires configuration device) |
| Configuration | — | External EPCS / enhanced configuration via AS, PS, JTAG, or FPP |
| Product Status | — | Obsolete (per Xecor cross-reference data) |