EP3SE260F1152C4LN vs EP3SE260F1152C4N 比較

詳細並排比較 EP3SE260F1152C4LN 由 Intel 與 EP3SE260F1152C4N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
EP3SE260F1152C4LN EP3SE260F1152C4LN - Stratix III E FPGA 255K LE 1152-FCBGA | Intel

EP3SE260F1152C4LN - Stratix III E FPGA 255K LE 1152-FCBGA | Intel

EP3SE260F1152C4LN ⚠ 最後購買機會

規格比較

參數 EP3SE260F1152C4LN EP3SE260F1152C4N
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 最後購買 Obsolete
Family Stratix III E Stratix III (Enhanced)
Logic Elements (LE) 255,000 —
Embedded Memory 16,672,768 bits 16,672,768 bits (16.67 Mbit)
Logic Array Blocks (LABs) 10,200 —
User I/Os 744 —
封裝 1152-ball FC-BGA 1152-ball FC-FBGA (flip-chip)
Process Technology 65 nm CMOS 65 nm CMOS
Core Voltage 0.9 V 1.1 V
Core Clock Speed 375 MHz (max) —
Transceiver Data Rate 717 MHz —
Speed Grade C4 -4 (commercial temperature)
工作溫度 0C to +85C (commercial) 0C to +85C (commercial, 'C' suffix)
安裝類型 Surface Mount (BGA) Surface Mount (BGA)
MSL 等級 [DATA_NEEDED: MSL level] —
RoHS 狀態 Compliant —
Series — Stratix III E
Logic Elements (LEs) — 255,000
Maximum User I/Os — 744
Number of LABs/CLBs — 10,200
DSP / 18x18 Multipliers — 768 embedded multipliers
Maximum Operating Frequency — 450 MHz
Packaging — Tray
Lead-Free / RoHS — Lead-free finish (RoHS compliant per distributor listing)
記憶體類型 — SRAM-based, volatile (requires configuration device)
Configuration — External EPCS / enhanced configuration via AS, PS, JTAG, or FPP
Product Status — Obsolete (per Xecor cross-reference data)

資料表與資源

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