EP3SE260F1152C4N vs EP3SE260F1152C2N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260F1152C4N disebabkan oleh Intel dan EP3SE260F1152C2N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP3SE260F1152C4N EP3SE260F1152C2N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Obsolete Obsolete
Series Stratix III E Stratix III E
Family Stratix III (Enhanced) FPGA - Field Programmable Gate Array
Logic Elements (LEs) 255,000 —
Embedded Memory 16,672,768 bits (16.67 Mbit) —
Maximum User I/Os 744 —
Number of LABs/CLBs 10,200 10200
DSP / 18x18 Multipliers 768 embedded multipliers —
Process Technology 65 nm CMOS 65 nm
Core Voltage 1.1 V —
Maximum Operating Frequency 450 MHz —
Kemasan 1152-ball FC-FBGA (flip-chip) —
Speed Grade -4 (commercial temperature) —
Suhu Operasi 0C to +85C (commercial, 'C' suffix) [DATA_NEEDED: operating temperature grade]
Jenis Pemasangan Surface Mount (BGA) Surface Mount
Packaging Tray —
Lead-Free / RoHS Lead-free finish (RoHS compliant per distributor listing) —
Jenis Ingatan SRAM-based, volatile (requires configuration device) —
Configuration External EPCS / enhanced configuration via AS, PS, JTAG, or FPP —
Product Status Obsolete (per Xecor cross-reference data) —
Number of Logic Elements — 255000
Total Memory Bits — 16672768
Number of I/O — 744
Voltage - Supply — 1.1 V
Kemasan / Case — 1152-BBGA, FCBGA
Maximum Frequency — 600 MHz
Supplier Device Package — 1152-FCBGA
Aras MSL — [DATA_NEEDED: MSL rating]
Status RoHS — Compliant
Lead Free — Yes (per EP3SE260F1152C2G comparison)
ECCN — [DATA_NEEDED: ECCN code]
Moisture Sensitivity — [DATA_NEEDED: MSL level]

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