EP3SE260F1152C4N vs EP3SE260F1152C2N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1152C4N sa pamamagitan ng Intel at EP3SE260F1152C2N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SE260F1152C4N EP3SE260F1152C2N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Obsolete
Series Stratix III E Stratix III E
Family Stratix III (Enhanced) FPGA - Field Programmable Gate Array
Logic Elements (LEs) 255,000 —
Embedded Memory 16,672,768 bits (16.67 Mbit) —
Maximum User I/Os 744 —
Number of LABs/CLBs 10,200 10200
DSP / 18x18 Multipliers 768 embedded multipliers —
Process Technology 65 nm CMOS 65 nm
Core Voltage 1.1 V —
Maximum Operating Frequency 450 MHz —
Packhaging 1152-ball FC-FBGA (flip-chip) —
Speed Grade -4 (commercial temperature) —
Temperature na Operasyon 0C to +85C (commercial, 'C' suffix) [DATA_NEEDED: operating temperature grade]
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount
Packaging Tray —
Lead-Free / RoHS Lead-free finish (RoHS compliant per distributor listing) —
Uri ng Memory SRAM-based, volatile (requires configuration device) —
Configuration External EPCS / enhanced configuration via AS, PS, JTAG, or FPP —
Product Status Obsolete (per Xecor cross-reference data) —
Number of Logic Elements — 255000
Total Memory Bits — 16672768
Number of I/O — 744
Voltage - Supply — 1.1 V
Packhaging / Kaso — 1152-BBGA, FCBGA
Maximum Frequency — 600 MHz
Supplier Device Package — 1152-FCBGA
Level ng MSL — [DATA_NEEDED: MSL rating]
Tindminan RoHS — Compliant
Lead Free — Yes (per EP3SE260F1152C2G comparison)
ECCN — [DATA_NEEDED: ECCN code]
Moisture Sensitivity — [DATA_NEEDED: MSL level]

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