EP3SE260F1517I4N vs EP3SE260F1517I4LN Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260F1517I4N disebabkan oleh Intel dan EP3SE260F1517I4LN disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SE260F1517I4N - Stratix III E FPGA, 255K LE, 1517-BGA | Intel
EP3SE260F1517I4N ⚠ Bahagian terakhir untuk beliIntel
EP3SE260F1517I4LN - 260K LE Stratix III E FPGA, 1517-FCBGA | Intel
EP3SE260F1517I4LN ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP3SE260F1517I4N | EP3SE260F1517I4LN |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Masa Terakhir Dibeli |
| Series | Stratix III E | — |
| Logic Elements | 255,000 | 255,000 |
| Embedded Memory Bits | 16,672,768 bits | 16,672,768 bits (~2,044 KBytes) |
| Embedded Memory (M9K/M144K blocks) | [DATA_NEEDED: total Kbits and block count] | — |
| User I/O Pins | 976 | — |
| Transceivers | [DATA_NEEDED: number of full-duplex channels] | Stratix III E family supports up to 24 transceivers up to 8.5 Gbps |
| Transceiver Data Rate | 600 Mbps to 6.375 Gbps | — |
| DSP Blocks | [DATA_NEEDED: number of 18x18 multipliers] | — |
| PLLs | [DATA_NEEDED: total PLL count] | — |
| Core Voltage | 1.1 V | — |
| Process Technology | TSMC 65 nm | 40 nm CMOS |
| Kemasan | 1517-BBGA, FCBGA | 1517-ball FCBGA (40 mm x 40 mm, 1.0 mm pitch) |
| Package Body Size | [DATA_NEEDED: mm x mm] | — |
| Suhu Operasi | -40 °C to +100 °C (Industrial) | -40C to +100C (case, industrial) |
| Operating Temperature Grade | Industrial (I4) | — |
| Jenis Pemasangan | Surface Mount (BGA) | — |
| Lead-Free / RoHS | [DATA_NEEDED: explicit RoHS statement] | Yes (N suffix) |
| Aras MSL | [DATA_NEEDED: MSL classification] | — |
| Logic Array Blocks (LABs) | — | 10,200 |
| User I/O Count | — | 976 |
| Family | — | Stratix III E (Enhanced) |
| Speed Grade | — | I4 (industrial, 4th tier) |
| Power Option | — | L (low-power) |
| DSP Blocks (18x18 multipliers) | — | Up to 384 (family-level, device-specific count not in provided data) |
| Partial Reconfiguration | — | Supported |
| Memory Interface Support | — | DDR3, DDR2, QDR II+ (hardened PHY) |
| Configuration Scheme | — | Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP), JTAG |