EP3SE260F1517I4N vs EP3SE260F1517I4LN Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1517I4N sa pamamagitan ng Intel at EP3SE260F1517I4LN sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE260F1517I4N - Stratix III E FPGA, 255K LE, 1517-BGA | Intel
EP3SE260F1517I4N ⚠ Huling PagbiliIntel
EP3SE260F1517I4LN - 260K LE Stratix III E FPGA, 1517-FCBGA | Intel
EP3SE260F1517I4LN ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SE260F1517I4N | EP3SE260F1517I4LN |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Huling Pagbili |
| Series | Stratix III E | — |
| Logic Elements | 255,000 | 255,000 |
| Embedded Memory Bits | 16,672,768 bits | 16,672,768 bits (~2,044 KBytes) |
| Embedded Memory (M9K/M144K blocks) | [DATA_NEEDED: total Kbits and block count] | — |
| User I/O Pins | 976 | — |
| Transceivers | [DATA_NEEDED: number of full-duplex channels] | Stratix III E family supports up to 24 transceivers up to 8.5 Gbps |
| Transceiver Data Rate | 600 Mbps to 6.375 Gbps | — |
| DSP Blocks | [DATA_NEEDED: number of 18x18 multipliers] | — |
| PLLs | [DATA_NEEDED: total PLL count] | — |
| Core Voltage | 1.1 V | — |
| Process Technology | TSMC 65 nm | 40 nm CMOS |
| Packhaging | 1517-BBGA, FCBGA | 1517-ball FCBGA (40 mm x 40 mm, 1.0 mm pitch) |
| Package Body Size | [DATA_NEEDED: mm x mm] | — |
| Temperature na Operasyon | -40 °C to +100 °C (Industrial) | -40C to +100C (case, industrial) |
| Operating Temperature Grade | Industrial (I4) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | — |
| Lead-Free / RoHS | [DATA_NEEDED: explicit RoHS statement] | Yes (N suffix) |
| Level ng MSL | [DATA_NEEDED: MSL classification] | — |
| Logic Array Blocks (LABs) | — | 10,200 |
| User I/O Count | — | 976 |
| Family | — | Stratix III E (Enhanced) |
| Speed Grade | — | I4 (industrial, 4th tier) |
| Power Option | — | L (low-power) |
| DSP Blocks (18x18 multipliers) | — | Up to 384 (family-level, device-specific count not in provided data) |
| Partial Reconfiguration | — | Supported |
| Memory Interface Support | — | DDR3, DDR2, QDR II+ (hardened PHY) |
| Configuration Scheme | — | Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP), JTAG |