EP3SE50F484C3N vs EP3SE50F484C4LG Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE50F484C3N disebabkan oleh Intel dan EP3SE50F484C4LG disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP3SE50F484C3N EP3SE50F484C4LG
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Obsolete NRND
Family Stratix III E Stratix® III E
Device Logic Elements 47,500 —
Logic Array Blocks (LABs) 1,900 —
Adaptive Logic Modules (ALMs) 18,750 19,000 ALM
Embedded Memory (Bits) 5,760,000 —
User I/Os 296 —
Maximum Internal Frequency 717 MHz (typical); 800 MHz per DigChip —
Process Technology TSMC 40 nm low-power CMOS —
Kemasan 484-ball FBGA (FCBGA), 1.0 mm pitch 484-Ball FCBGA, 23 x 23 mm
Tegangan Pemberi Arus Core and I/O voltages per Stratix III E datasheet —
Suhu Operasi 0C to +85 C (commercial, C suffix) —
Jenis Pemasangan Surface Mount (BGA) Surface Mount
Aras MSL 3 (per JEDEC J-STD-020 for FCBGA packages) 3 (per JEDEC J-STD-020)
Status RoHS Lead-free (per DigiKey listing) —
Configuration Mode Passive Serial, Fast Passive Parallel, Fast Active Serial, JTAG —
Design Software Intel Quartus II (Stratix III support) Quartus II 11.0 or later
Status Lingkungan Hidup Obsolete (per Worldway listing 2026-04-05) —
Logic Elements — 47,500 LE
Embedded Memory — 5.49 Mbit (2,886 Kbit M9K + M144K blocks)
Maximum User I/O — 296
Hardware Multipliers (18x18) — 384
PLLs — 4
Operating Supply Voltage (Core) — 1.1 V
Gambaran Suhu Operasi — 0°C to +85°C (Commercial)
Speed Grade — -4
Process Node — 40 nm TSMC
Lead-Free / RoHS — Yes (lead-free finish, RoHS compliant)

Laporan Datasheet & Sumber

Lihat Semua Produk Buat BOQ Minta Bao Harga