EP3SE50F484C3N vs EP3SE50F484C4LG 比較

詳細並排比較 EP3SE50F484C3N 由 Intel 與 EP3SE50F484C4LG 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3SE50F484C3N EP3SE50F484C4LG
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 Obsolete NRND
Family Stratix III E Stratix® III E
Device Logic Elements 47,500 —
Logic Array Blocks (LABs) 1,900 —
Adaptive Logic Modules (ALMs) 18,750 19,000 ALM
Embedded Memory (Bits) 5,760,000 —
User I/Os 296 —
Maximum Internal Frequency 717 MHz (typical); 800 MHz per DigChip —
Process Technology TSMC 40 nm low-power CMOS —
封裝 484-ball FBGA (FCBGA), 1.0 mm pitch 484-Ball FCBGA, 23 x 23 mm
供應電壓 Core and I/O voltages per Stratix III E datasheet —
工作溫度 0C to +85 C (commercial, C suffix) —
安裝類型 Surface Mount (BGA) Surface Mount
MSL 等級 3 (per JEDEC J-STD-020 for FCBGA packages) 3 (per JEDEC J-STD-020)
RoHS 狀態 Lead-free (per DigiKey listing) —
Configuration Mode Passive Serial, Fast Passive Parallel, Fast Active Serial, JTAG —
Design Software Intel Quartus II (Stratix III support) Quartus II 11.0 or later
生命週期狀態 Obsolete (per Worldway listing 2026-04-05) —
Logic Elements — 47,500 LE
Embedded Memory — 5.49 Mbit (2,886 Kbit M9K + M144K blocks)
Maximum User I/O — 296
Hardware Multipliers (18x18) — 384
PLLs — 4
Operating Supply Voltage (Core) — 1.1 V
工作溫度範圍 — 0°C to +85°C (Commercial)
Speed Grade — -4
Process Node — 40 nm TSMC
Lead-Free / RoHS — Yes (lead-free finish, RoHS compliant)

資料表與資源

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