EP3SE50F780C2 vs EP3SE50F780C4N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE50F780C2 disebabkan oleh Intel dan EP3SE50F780C4N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP3SE50F780C2 EP3SE50F780C4N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND NRND
Family Stratix III E Stratix III E
Manufacturer Intel (formerly Altera) —
Logic Elements (LE) 47,500 47,500
LABs / CLBs 1,900 —
Total Memory Bits 5,760,000 —
User I/O Count 488 —
DSP Blocks (18x18 multipliers) 384 432
Core Voltage 1.1 V —
Process Technology 65 nm —
Operating Frequency Up to 600 MHz —
Kemasan 780-BBGA, FC-FBGA 780-Ball FBGA, 29 mm x 29 mm, 1.0 mm pitch
Jenis Pemasangan Surface Mount Surface Mount (BGA)
Status RoHS [DATA_NEEDED: current RoHS status] Lead-free / RoHS compliant
Number of Pins / Terminals 780 —
Form of Terminal Ball —
Package Code BGA —
Operating Temperature Grade Commercial (C2) —
Embedded Memory Bits — 5,760,000
Embedded Memory (M9K/M144K blocks) — 488 (per family datasheet)
Number of LABs — 1900
Maximum User I/Os — 488
PLLs — 12 (per family datasheet)
Maximum Operating Frequency — 717 MHz
Transceiver Channels — Up to 12 (per family, model-dependent)
Transceiver Data Rate — Up to 6.375 Gbps (per Stratix III E family)
Process Node — 40 nm
Tegangan Pemberi Arus — Core 0.9 V, I/O 1.2 V-3.3 V (multi-rail)
Suhu Operasi — 0C to +85C (C4 commercial grade)
Configuration Modes — JTAG, Passive Serial, Fast Passive Parallel
Aras MSL — 3 (per JEDEC J-STD-020, FBGA package)
Hard Memory Controller — DDR2/DDR3 SDRAM (per Stratix III E family)

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