EP3SE50F780C2 vs EP3SE50F780C4N 比較

詳細並排比較 EP3SE50F780C2 由 Intel 與 EP3SE50F780C4N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3SE50F780C2 EP3SE50F780C4N
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 NRND NRND
Family Stratix III E Stratix III E
Manufacturer Intel (formerly Altera) —
Logic Elements (LE) 47,500 47,500
LABs / CLBs 1,900 —
Total Memory Bits 5,760,000 —
User I/O Count 488 —
DSP Blocks (18x18 multipliers) 384 432
Core Voltage 1.1 V —
Process Technology 65 nm —
Operating Frequency Up to 600 MHz —
封裝 780-BBGA, FC-FBGA 780-Ball FBGA, 29 mm x 29 mm, 1.0 mm pitch
安裝類型 Surface Mount Surface Mount (BGA)
RoHS 狀態 [DATA_NEEDED: current RoHS status] Lead-free / RoHS compliant
Number of Pins / Terminals 780 —
Form of Terminal Ball —
Package Code BGA —
Operating Temperature Grade Commercial (C2) —
Embedded Memory Bits — 5,760,000
Embedded Memory (M9K/M144K blocks) — 488 (per family datasheet)
Number of LABs — 1900
Maximum User I/Os — 488
PLLs — 12 (per family datasheet)
Maximum Operating Frequency — 717 MHz
Transceiver Channels — Up to 12 (per family, model-dependent)
Transceiver Data Rate — Up to 6.375 Gbps (per Stratix III E family)
Process Node — 40 nm
供應電壓 — Core 0.9 V, I/O 1.2 V-3.3 V (multi-rail)
工作溫度 — 0C to +85C (C4 commercial grade)
Configuration Modes — JTAG, Passive Serial, Fast Passive Parallel
MSL 等級 — 3 (per JEDEC J-STD-020, FBGA package)
Hard Memory Controller — DDR2/DDR3 SDRAM (per Stratix III E family)

資料表與資源

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