EP3SE50F780I3G vs EP3SE50F780I4G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE50F780I3G disebabkan oleh Intel dan EP3SE50F780I4G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SE50F780I3G | EP3SE50F780I4G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Aktif |
| Family | Stratix III E | Stratix III E |
| Logic Elements (LE) | 47,500 | — |
| Adaptive Logic Modules (ALM) | 19,000 | — |
| Embedded Memory | 8.7 Mbits (M9K + M144K blocks) | 5,760,000 bit (5.49 Mbit) |
| DSP Blocks | 264 (18x18 multipliers) | [DATA_NEEDED: DSP block count] |
| Maximum User I/O Pins | 488 | — |
| Transceivers | 12 channels, up to 3.75 Gbps | [DATA_NEEDED: transceiver count and data rate] |
| Core Voltage | 1.1 V | — |
| Process Technology | TSMC 40 nm | — |
| Kemasan | 780-pin FC-FBGA (F780) 29x29 mm | 780-ball FBGA (FCBGA) |
| Suhu Operasi | -40C to +100C (Industrial, I3) | — |
| Speed Grade | 3 | I4 |
| Memory Interfaces | DDR3 up to 800 MHz, DDR2, QDR II+ SRAM | — |
| PCI Express Hard IP | Gen1 x1/x4/x8 | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Aras MSL | 3 | — |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Logic Elements | — | 47,500 LE |
| Adaptive Logic Modules (ALMs) | — | 19,000 ALM |
| Maximum User I/Os | — | 488 I/O |
| Operating Supply Voltage (Core) | — | 1.1 V |
| Gambaran Suhu Operasi | — | -40C to +100C (Industrial) |
| Number of Logic Array Blocks (LABs) | — | [DATA_NEEDED: LABs count] |
| Configuration Method | — | JTAG, Passive Serial, FPP, Active Serial |