EP3SE50F780I3G vs EP3SE50F780I4G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE50F780I3G sa pamamagitan ng Intel at EP3SE50F780I4G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE50F780I3G | EP3SE50F780I4G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Aktibo |
| Family | Stratix III E | Stratix III E |
| Logic Elements (LE) | 47,500 | — |
| Adaptive Logic Modules (ALM) | 19,000 | — |
| Embedded Memory | 8.7 Mbits (M9K + M144K blocks) | 5,760,000 bit (5.49 Mbit) |
| DSP Blocks | 264 (18x18 multipliers) | [DATA_NEEDED: DSP block count] |
| Maximum User I/O Pins | 488 | — |
| Transceivers | 12 channels, up to 3.75 Gbps | [DATA_NEEDED: transceiver count and data rate] |
| Core Voltage | 1.1 V | — |
| Process Technology | TSMC 40 nm | — |
| Packhaging | 780-pin FC-FBGA (F780) 29x29 mm | 780-ball FBGA (FCBGA) |
| Temperature na Operasyon | -40C to +100C (Industrial, I3) | — |
| Speed Grade | 3 | I4 |
| Memory Interfaces | DDR3 up to 800 MHz, DDR2, QDR II+ SRAM | — |
| PCI Express Hard IP | Gen1 x1/x4/x8 | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Level ng MSL | 3 | — |
| Tindminan RoHS | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Logic Elements | — | 47,500 LE |
| Adaptive Logic Modules (ALMs) | — | 19,000 ALM |
| Maximum User I/Os | — | 488 I/O |
| Operating Supply Voltage (Core) | — | 1.1 V |
| Hanay ng Temperature na Operasyon | — | -40C to +100C (Industrial) |
| Number of Logic Array Blocks (LABs) | — | [DATA_NEEDED: LABs count] |
| Configuration Method | — | JTAG, Passive Serial, FPP, Active Serial |