EP3SL340F1760C2 vs EP3SL340F1760I3 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL340F1760C2 disebabkan oleh Intel dan EP3SL340F1760I3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SL340F1760I3 - Stratix III L FPGA, 337.5K LE, 1760-BGA | Intel
EP3SL340F1760I3 ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP3SL340F1760C2 | EP3SL340F1760I3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Masa Terakhir Dibeli |
| Series | Stratix III L | Stratix III L |
| Family | Stratix III | — |
| Logic Elements (LE) | 337,500 | — |
| Logic Array Blocks (LABs) | 13,500 | — |
| Embedded Memory (bits) | 18,822,144 | — |
| User I/O Count | 1,120 | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | [DATA_NEEDED: 18x18 multiplier count] |
| Transceivers | [DATA_NEEDED: transceiver count and max data rate] | [DATA_NEEDED: transceiver count and data rate for this F1760 variant] |
| Maximum User I/O Voltage | 3.3 V (LVTTL/LVCMOS supporting up to 3.0 V LVDS) | — |
| Core Voltage | 0.9 V / 1.1 V | 1.1 V |
| Process Node | 40 nm TSMC | — |
| Kemasan | 1760-ball FCBGA (FineLine BGA) | — |
| Ball Pitch | 1.0 mm | — |
| Suhu Operasi | 0C to +85C (Commercial, C2 suffix) | -40 °C to 100 °C (Industrial grade, I3 suffix) |
| Status RoHS | Compliant | Compliant (Pb-free BGA balls) |
| Configuration | SRAM-based, supports JTAG, FPP, AS, PS | — |
| Programmable Power Technology | Yes | — |
| PCIe Hard IP | Yes (Gen1/Gen2) | — |
| Logic Elements | — | 337,500 LE |
| LABs (Logic Array Blocks) | — | 13,500 |
| Embedded Memory Bits | — | 18,822,144 bit |
| User I/Os | — | 1120 |
| Number of Pins / Balls | — | 1760 |
| Package Type | — | FC-FBGA (1760-ball, FineLine BGA) |
| Package Code | — | BGA1760, 42x42, 40 |
| Process Technology | — | 65 nm |
| Speed Grade | — | I3 (Industrial, mid-speed bin) |
| Jenis Pemasangan | — | Surface Mount |
| Configuration Memory | — | SRAM-based, volatile (requires external configuration device) |
| PLLs | — | [DATA_NEEDED: PLL count] |
| Aras MSL | — | MSL3 (JEDEC J-STD-020, reflow 245 °C peak) |