EP3SL340F1760C2 vs EP3SL340F1760I3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL340F1760C2 sa pamamagitan ng Intel at EP3SL340F1760I3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SL340F1760I3 - Stratix III L FPGA, 337.5K LE, 1760-BGA | Intel
EP3SL340F1760I3 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SL340F1760C2 | EP3SL340F1760I3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Huling Pagbili |
| Series | Stratix III L | Stratix III L |
| Family | Stratix III | — |
| Logic Elements (LE) | 337,500 | — |
| Logic Array Blocks (LABs) | 13,500 | — |
| Embedded Memory (bits) | 18,822,144 | — |
| User I/O Count | 1,120 | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | [DATA_NEEDED: 18x18 multiplier count] |
| Transceivers | [DATA_NEEDED: transceiver count and max data rate] | [DATA_NEEDED: transceiver count and data rate for this F1760 variant] |
| Maximum User I/O Voltage | 3.3 V (LVTTL/LVCMOS supporting up to 3.0 V LVDS) | — |
| Core Voltage | 0.9 V / 1.1 V | 1.1 V |
| Process Node | 40 nm TSMC | — |
| Packhaging | 1760-ball FCBGA (FineLine BGA) | — |
| Ball Pitch | 1.0 mm | — |
| Temperature na Operasyon | 0C to +85C (Commercial, C2 suffix) | -40 °C to 100 °C (Industrial grade, I3 suffix) |
| Tindminan RoHS | Compliant | Compliant (Pb-free BGA balls) |
| Configuration | SRAM-based, supports JTAG, FPP, AS, PS | — |
| Programmable Power Technology | Yes | — |
| PCIe Hard IP | Yes (Gen1/Gen2) | — |
| Logic Elements | — | 337,500 LE |
| LABs (Logic Array Blocks) | — | 13,500 |
| Embedded Memory Bits | — | 18,822,144 bit |
| User I/Os | — | 1120 |
| Number of Pins / Balls | — | 1760 |
| Package Type | — | FC-FBGA (1760-ball, FineLine BGA) |
| Package Code | — | BGA1760, 42x42, 40 |
| Process Technology | — | 65 nm |
| Speed Grade | — | I3 (Industrial, mid-speed bin) |
| Uri ng Pagpapasok | — | Surface Mount |
| Configuration Memory | — | SRAM-based, volatile (requires external configuration device) |
| PLLs | — | [DATA_NEEDED: PLL count] |
| Level ng MSL | — | MSL3 (JEDEC J-STD-020, reflow 245 °C peak) |