EP3SL50F780C2 vs EP3SL50F780C3G Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL50F780C2 disebabkan oleh Intel dan EP3SL50F780C3G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP3SL50F780C2 EP3SL50F780C3G
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Family Stratix III L Stratix III L
Logic Elements (LE) 47,500 47,500
Logic Array Blocks (LABs) 1,900 —
Embedded Memory (bits) 2,184,192 2,184,192
Maximum User I/Os 488 —
Core Voltage 1.1 V 1.1 V
Process Technology 65 nm TSMC 40 nm low-power
Kemasan 780-ball FCBGA (Flip-Chip BGA) 780-ball FBGA
Suhu Operasi 0°C to +85°C (commercial) 0C to +85C (commercial)
Maximum Core Frequency 600 MHz —
Configuration Interface JTAG / passive serial / fast passive parallel —
I/O Standards LVDS, LVCMOS, SSTL, HSTL, DDR2/DDR3 memory interfaces —
Embedded Memory Type TriMatrix (MLAB, M9K, M144K blocks) —
Status RoHS Compliant Compliant (per DigiKey listing)
Jenis Pemasangan Surface Mount (BGA) SMD/SMT
Adaptive Logic Modules (ALM) — 19,000
Distributed RAM — 2.08 Mbit
User I/O Count — 488
Temperature Grade Suffix — C (commercial, "3" speed grade)
Packaging — Tray
Configuration Method — SRAM-based, JTAG/AS configuration
Design Software — Intel Quartus II (v9.0+)

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