EP3SL50F780C2 vs EP3SL50F780C3G 比較

詳細並排比較 EP3SL50F780C2 由 Intel 與 EP3SL50F780C3G 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3SL50F780C2 EP3SL50F780C3G
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Family Stratix III L Stratix III L
Logic Elements (LE) 47,500 47,500
Logic Array Blocks (LABs) 1,900 —
Embedded Memory (bits) 2,184,192 2,184,192
Maximum User I/Os 488 —
Core Voltage 1.1 V 1.1 V
Process Technology 65 nm TSMC 40 nm low-power
封裝 780-ball FCBGA (Flip-Chip BGA) 780-ball FBGA
工作溫度 0°C to +85°C (commercial) 0C to +85C (commercial)
Maximum Core Frequency 600 MHz —
Configuration Interface JTAG / passive serial / fast passive parallel —
I/O Standards LVDS, LVCMOS, SSTL, HSTL, DDR2/DDR3 memory interfaces —
Embedded Memory Type TriMatrix (MLAB, M9K, M144K blocks) —
RoHS 狀態 Compliant Compliant (per DigiKey listing)
安裝類型 Surface Mount (BGA) SMD/SMT
Adaptive Logic Modules (ALM) — 19,000
Distributed RAM — 2.08 Mbit
User I/O Count — 488
Temperature Grade Suffix — C (commercial, "3" speed grade)
Packaging — Tray
Configuration Method — SRAM-based, JTAG/AS configuration
Design Software — Intel Quartus II (v9.0+)

資料表與資源

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