EP3SL50F780C2 vs EP3SL50F780C3G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL50F780C2 sa pamamagitan ng Intel at EP3SL50F780C3G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SL50F780C3G - Stratix III L FPGA, 47.5K LE, 488 I/O, 780-FBGA | Altera / Intel
EP3SL50F780C3G ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP3SL50F780C2 | EP3SL50F780C3G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Stratix III L | Stratix III L |
| Logic Elements (LE) | 47,500 | 47,500 |
| Logic Array Blocks (LABs) | 1,900 | — |
| Embedded Memory (bits) | 2,184,192 | 2,184,192 |
| Maximum User I/Os | 488 | — |
| Core Voltage | 1.1 V | 1.1 V |
| Process Technology | 65 nm | TSMC 40 nm low-power |
| Packhaging | 780-ball FCBGA (Flip-Chip BGA) | 780-ball FBGA |
| Temperature na Operasyon | 0°C to +85°C (commercial) | 0C to +85C (commercial) |
| Maximum Core Frequency | 600 MHz | — |
| Configuration Interface | JTAG / passive serial / fast passive parallel | — |
| I/O Standards | LVDS, LVCMOS, SSTL, HSTL, DDR2/DDR3 memory interfaces | — |
| Embedded Memory Type | TriMatrix (MLAB, M9K, M144K blocks) | — |
| Tindminan RoHS | Compliant | Compliant (per DigiKey listing) |
| Uri ng Pagpapasok | Surface Mount (BGA) | SMD/SMT |
| Adaptive Logic Modules (ALM) | — | 19,000 |
| Distributed RAM | — | 2.08 Mbit |
| User I/O Count | — | 488 |
| Temperature Grade Suffix | — | C (commercial, "3" speed grade) |
| Packaging | — | Tray |
| Configuration Method | — | SRAM-based, JTAG/AS configuration |
| Design Software | — | Intel Quartus II (v9.0+) |