EP3SL70F484C2 vs EP3SL70F484I3 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL70F484C2 disebabkan oleh Intel dan EP3SL70F484I3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP3SL70F484I3 EP3SL70F484I3 - Stratix III L FPGA, 67.5K LE, 484-FBGA | Intel

EP3SL70F484I3 - Stratix III L FPGA, 67.5K LE, 484-FBGA | Intel

EP3SL70F484I3 ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP3SL70F484C2 EP3SL70F484I3
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND Masa Terakhir Dibeli
Series Stratix III L —
Family Stratix III L FPGA Stratix III L
Logic Elements 67,500 67,500
Embedded Memory 2,699,264 bits —
Logic Array Blocks (LABs) 2,700 2,700
User I/O Count 296 —
Core Voltage 1.1 V —
Process Technology 65 nm —
Maximum Core Frequency 600 MHz —
Package Type 484-ball FC-FBGA (FineLine BGA) —
Package Pin Count 484 —
Suhu Operasi 0C to +85C (Commercial) -40C to +100C (industrial)
Speed Grade C2 -3 (mid-tier)
Jenis Pemasangan Surface Mount —
Status RoHS [DATA_NEEDED: RoHS status] Compliant
Adaptive Logic Modules (ALMs) — 33,000
Total Embedded Memory — 2,699,264 bits (337 KB)
M9K Memory Blocks — 288
M144K Memory Blocks — 12
DSP Blocks (18x18 multipliers) — 384
User I/O Pins — 296
Transceivers — Up to 12 (3.75 Gbps) [DATA_NEEDED: confirm exact count for F484 package]
PLLs — 8 (4 enhanced PLLs + 4 fast PLLs)
Process Node — TSMC 40 nm
Kemasan — 484-ball Flip-Chip BGA (FBGA-484), 1.0 mm pitch
Configuration Modes — FPP, AS, PS, JTAG, AES encryption
Design Software — Quartus II (legacy)

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