EP4SGX70DF29I3G vs EP4SGX70HF35I3G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4SGX70DF29I3G disebabkan oleh Intel dan EP4SGX70HF35I3G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP4SGX70DF29I3G | EP4SGX70HF35I3G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Series | Stratix IV GX | Stratix IV GX |
| Process Technology | 40 nm | 40 nm TSMC |
| Logic Elements (LE) | 72,600 | — |
| Embedded Memory Bits | 7,564,880 (about 7.5 Mbit) | — |
| Embedded Memory Blocks | 72600 | — |
| Number of Logic Cells / Arrays | 372 | — |
| Number of User I/O Pins | 372 | — |
| Number of Transceiver Channels | [DATA_NEEDED: exact channel count for this device] | — |
| Transceiver Data Rate | [DATA_NEEDED: per-channel data rate] | — |
| Package Type | 780-Ball FCBGA (Fine-pitch Chip-Scale BGA, flip-chip) | — |
| Package Code | DF29 | — |
| Operating Temperature Grade | Industrial (I3) | — |
| Junction Temperature Range | -40C to +100C | — |
| Core Supply Voltage | 0.87 V to 0.93 V | 950 mV |
| Speed Grade | -3 | I3 |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (Flip-Chip BGA) |
| Aras MSL | [DATA_NEEDED: MSL rating] | — |
| Status RoHS | Compliant | — |
| Boson Bebas | [DATA_NEEDED: halogen-free claim] | — |
| Logic Elements | — | 72,600 LE |
| Adaptive Logic Modules (ALMs) | — | 29,040 ALM |
| Embedded Memory | — | 7.20 Mbit (7,564,880 bits) |
| User I/Os | — | 480 |
| Transceivers | — | 9 channels up to 8.5 Gbps (GX) |
| 18x18 Multipliers | — | 488 |
| PLLs | — | 4 per quadrant |
| Suhu Operasi | — | -40C to +100C (Industrial) |
| Kemasan | — | 1152-ball FCBGA, 35x35 mm, 1.0 mm pitch |
| Packaging | — | Tray |