EPM1270F256C5N vs EPM2210F256C3N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EPM1270F256C5N disebabkan oleh Altera dan EPM2210F256C3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EPM1270F256C5N EPM2210F256C3N
Merek Altera Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Harga Unit (USD) $16.20 —
Series MAX II MAX II
Family EPM1270 —
Device Type CPLD (Complex Programmable Logic Device) CPLD (Complex Programmable Logic Device)
Number of Macrocells 980 —
Number of Logic Elements 1270 —
Number of User I/O 212 —
Propagation Delay (tPD) 6.2 ns —
Maximum Frequency (fMAX) 201.1 MHz —
Supply Voltage - Internal 2.5 V / 3.3 V —
Suhu Operasi 0°C to 85°C (TJ) —
Jenis Pemasangan Surface Mount Surface Mount
Kemasan / Case 256-FBGA (256-BGA) —
Supplier Device Package 256-FBGA —
Process Technology 0.18 µm 0.18 um flash CMOS
Programmable Type Non-volatile flash, in-system programmable In System Programmable (JTAG, IEEE 1149.1)
Programming Interface JTAG (IEEE 1149.1) / ISP —
Status RoHS Details (per distributor product page) Compliant (per DigiKey product page)
Macrocells — 1700
Logic Elements / Blocks — 2210
Number of User I/Os — 204
Maximum Propagation Delay (tPD) — 7 ns
Maximum Internal Frequency (fMAX) — 304 MHz
Internal Supply Voltage — 2.5 V / 3.3 V (on-chip regulator allows single 3.3 V rail)
I/O Standard Support — 1.5 V / 1.8 V / 2.5 V / 3.3 V LVCMOS (MultiVolt)
User Flash Memory — 8 Kbits
Configuration Memory — On-chip flash (non-volatile, instant-on)
Suhu Hubungan Operasi — 0 C to 85 C (commercial, TJ suffix 'C')
Kemasan — 256-ball FineLine BGA (FBGA), 17 x 17 mm, 1.0 mm pitch
Aras MSL — 3 (per JEDEC J-STD-020, typical for FBGA)

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