EPM1270F256C5N vs EPM2210F256C3N 比較

詳細並排比較 EPM1270F256C5N 由 Altera 與 EPM2210F256C3N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EPM1270F256C5N EPM2210F256C3N
品牌 Altera Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
單價 (USD) $16.20 —
Series MAX II MAX II
Family EPM1270 —
Device Type CPLD (Complex Programmable Logic Device) CPLD (Complex Programmable Logic Device)
Number of Macrocells 980 —
Number of Logic Elements 1270 —
Number of User I/O 212 —
Propagation Delay (tPD) 6.2 ns —
Maximum Frequency (fMAX) 201.1 MHz —
Supply Voltage - Internal 2.5 V / 3.3 V —
工作溫度 0°C to 85°C (TJ) —
安裝類型 Surface Mount Surface Mount
封裝 / 外殼 256-FBGA (256-BGA) —
Supplier Device Package 256-FBGA —
Process Technology 0.18 µm 0.18 um flash CMOS
Programmable Type Non-volatile flash, in-system programmable In System Programmable (JTAG, IEEE 1149.1)
Programming Interface JTAG (IEEE 1149.1) / ISP —
RoHS 狀態 Details (per distributor product page) Compliant (per DigiKey product page)
Macrocells — 1700
Logic Elements / Blocks — 2210
Number of User I/Os — 204
Maximum Propagation Delay (tPD) — 7 ns
Maximum Internal Frequency (fMAX) — 304 MHz
Internal Supply Voltage — 2.5 V / 3.3 V (on-chip regulator allows single 3.3 V rail)
I/O Standard Support — 1.5 V / 1.8 V / 2.5 V / 3.3 V LVCMOS (MultiVolt)
User Flash Memory — 8 Kbits
Configuration Memory — On-chip flash (non-volatile, instant-on)
工作接面溫度 — 0 C to 85 C (commercial, TJ suffix 'C')
封裝 — 256-ball FineLine BGA (FBGA), 17 x 17 mm, 1.0 mm pitch
MSL 等級 — 3 (per JEDEC J-STD-020, typical for FBGA)

資料表與資源

瀏覽所有產品 建立 BOM 索取報價