EPM570F256C4N vs EPM570F256C3N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EPM570F256C4N disebabkan oleh Intel dan EPM570F256C3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EPM570F256C4N | EPM570F256C3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | MAX II | — |
| Logic Elements | 570 LE | — |
| Macrocells | 440 | — |
| Logic Array Blocks (LABs) | 57 | — |
| User I/O Count | 160 | [DATA_NEEDED: confirm exact user-IO count for F256 package] |
| User Flash Memory (UFM) | 8 Kbit | 8 Kbits |
| Kemasan | 256-ball FineLine BGA (FBGA) | 256-ball FBGA (FineLine BGA) |
| Package Size | 17 mm × 17 mm | — |
| Process Technology | 0.18 µm 6-layer-metal flash | 0.18 um, 6-layer-metal flash CMOS |
| Maximum Internal Frequency | 304 MHz | — |
| Pin-to-Pin Logic Delay | 5.4 ns | — |
| Operating Supply Voltage (VCCINT) | 2.5 V, 3.3 V | — |
| MultiVolt I/O Voltages | 1.5 V, 1.8 V, 2.5 V, 3.3 V | — |
| Gambaran Suhu Operasi | 0 °C to +70 °C (commercial) | — |
| In-System Programmability (ISP) | Yes (JTAG) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Status RoHS | Compliant | Compliant (per DigiKey listing) |
| Family | — | MAX II |
| Logic Elements (LEs) | — | 570 |
| Equivalent Macrocells | — | 440 |
| Maximum Operating Frequency | — | 304 MHz |
| Core Voltage | — | 2.5 V / 3.3 V |
| I/O Voltage Support (MultiVolt) | — | 1.5 V, 1.8 V, 2.5 V, 3.3 V |
| Operating Temperature (C3 grade) | — | 0 C to +85 C (commercial) |
| Programming Interface | — | JTAG (IEEE 1532 / IEEE 1149.1) + ISP |
| Aras MSL | — | [DATA_NEEDED: MSL level not stated in provided data] |
| Lead-Free | — | Yes (per suffix 'N' convention) |
| Typical Macroscopic Functions | — | Glue logic, bus bridging, I/O expansion, power sequencing |