H5ANAG8NCMR-VKC vs H5ANAG8NAMR-UHC Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci H5ANAG8NCMR-VKC disebabkan oleh SK hynix dan H5ANAG8NAMR-UHC disebabkan oleh SK hynix. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | H5ANAG8NCMR-VKC | H5ANAG8NAMR-UHC |
|---|---|---|
| Merek | SK hynix | SK hynix |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Jenis Ingatan | DDR4 SDRAM | DDR4 SDRAM |
| Saiz Ingatan | 16 Gb | — |
| Memory Organization | 2G x 8 | — |
| Kadar Data | 2666 Mbps/pin (DDR4-2666) | DDR4-2400 (2400 MT/s) |
| Supply Voltage (VDD) | 1.2 V | — |
| I/O Voltage (VDDQ) | 1.2 V | — |
| Kemasan | FBGA-78 | FBGA-78 |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Speed Grade | VK (per SK hynix speed-bin suffix) | — |
| Power Class | Normal Power | — |
| Bank Groups | 4 | — |
| Banks Total | 16 | — |
| Suhu Operasi | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Latensi CAS | [DATA_NEEDED: CAS latency for VK speed bin] | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant (lead-free FBGA package) |
| Packaging | [DATA_NEEDED: standard packing quantity] | — |
| Manufacturer Process | CMOS DRAM | — |
| Manufacturer | — | SK Hynix |
| Density | — | 16 Gbit |
| Organisasi | — | 2G x 8 |
| Tegangan Pemberi Arus | — | 1.2 V |
| Antaramuka | — | Parallel, DDR4 |
| Bank Group Architecture | — | DDR4 bank-group architecture |
| On-Die Termination (ODT) | — | Yes |
| Refresh | — | Self-refresh and auto-refresh (DDR4) |
| Aras MSL | — | [DATA_NEEDED: moisture sensitivity level] |
| Applications | — | Data storage, firmware boot, industrial controllers, computing modules |