H5TC4G63CFR-PBL vs H5TC4G63MFR-PBA Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci H5TC4G63CFR-PBL disebabkan oleh SK hynix dan H5TC4G63MFR-PBA disebabkan oleh SK hynix. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

SK hynix
H5TC4G63CFR-PBL H5TC4G63CFR-PBL - 4Gb DDR3L SDRAM 256Mx16 | SK hynix

H5TC4G63CFR-PBL - 4Gb DDR3L SDRAM 256Mx16 | SK hynix

H5TC4G63CFR-PBL ✓ Aktif
SK hynix
H5TC4G63MFR-PBA H5TC4G63MFR-PBA - 4Gb DDR3L SDRAM 256Mx16 | SK hynix

H5TC4G63MFR-PBA - 4Gb DDR3L SDRAM 256Mx16 | SK hynix

H5TC4G63MFR-PBA ✓ Aktif

Pengandingan Spesifikasi

Parametr H5TC4G63CFR-PBL H5TC4G63MFR-PBA
Merek SK hynix SK hynix
Kategori Memory ICs Memory ICs
Status Lingkungan Hidup Aktif Aktif
Jenis Ingatan DDR3L SDRAM DDR3L SDRAM
Saiz Ingatan 4 Gb (256M x 16) —
Tegangan Pemberi Arus 1.35 V —
Kadar Data 1600 Mbps (PC3L-12800) 1866 Mbps (PC3L-14900)
Kemasan 96-ball FBGA (TFBGA) 96-ball FBGA
Number of Terminals 96 —
Package Shape RECTANGULAR —
Terminal Form BALL —
Burst Length 8 BL8, BL4 (with burst chop)
Latensi CAS 11, 12, 13 —
Number of Banks 8 8
Refresh Period 7.8 us at 85C —
RoHS Compliant —
Lead-Free Yes —
Boson Bebas Yes —
Density — 4 Gb
Organisasi — 256M x 16
Supply Voltage (VDD/VDDQ) — 1.35V (+0.100V/-0.067V)
CAS Latency (CL) — Programmable
CAS Write Latency (CWL) — Programmable
Additive Latency — Programmable
On-Die Termination (ODT) — Yes
ZQ Calibration — Yes
Write Leveling — Yes
Auto Self-Refresh — Yes
Temperature-Compensated Self-Refresh — Yes
Process Technology — 30nm-class
RoHS Compliant — Yes (Lead-Free & Halogen-Free)

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