H5TC4G63CFR-PBL vs H5TC4G63MFR-PBA 比較

詳細並排比較 H5TC4G63CFR-PBL 由 SK hynix 與 H5TC4G63MFR-PBA 由 SK hynix. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

SK hynix
H5TC4G63CFR-PBL H5TC4G63CFR-PBL - 4Gb DDR3L SDRAM 256Mx16 | SK hynix

H5TC4G63CFR-PBL - 4Gb DDR3L SDRAM 256Mx16 | SK hynix

H5TC4G63CFR-PBL ✓ 啟用中
SK hynix
H5TC4G63MFR-PBA H5TC4G63MFR-PBA - 4Gb DDR3L SDRAM 256Mx16 | SK hynix

H5TC4G63MFR-PBA - 4Gb DDR3L SDRAM 256Mx16 | SK hynix

H5TC4G63MFR-PBA ✓ 啟用中

規格比較

參數 H5TC4G63CFR-PBL H5TC4G63MFR-PBA
品牌 SK hynix SK hynix
類別 Memory ICs Memory ICs
生命週期狀態 啟用中 啟用中
記憶體類型 DDR3L SDRAM DDR3L SDRAM
記憶體容量 4 Gb (256M x 16) —
供應電壓 1.35 V —
資料速率 1600 Mbps (PC3L-12800) 1866 Mbps (PC3L-14900)
封裝 96-ball FBGA (TFBGA) 96-ball FBGA
Number of Terminals 96 —
Package Shape RECTANGULAR —
Terminal Form BALL —
Burst Length 8 BL8, BL4 (with burst chop)
CAS 延遲 11, 12, 13 —
Number of Banks 8 8
Refresh Period 7.8 us at 85C —
RoHS Compliant —
Lead-Free Yes —
無鹵素 Yes —
Density — 4 Gb
組織 — 256M x 16
Supply Voltage (VDD/VDDQ) — 1.35V (+0.100V/-0.067V)
CAS Latency (CL) — Programmable
CAS Write Latency (CWL) — Programmable
Additive Latency — Programmable
On-Die Termination (ODT) — Yes
ZQ Calibration — Yes
Write Leveling — Yes
Auto Self-Refresh — Yes
Temperature-Compensated Self-Refresh — Yes
Process Technology — 30nm-class
RoHS Compliant — Yes (Lead-Free & Halogen-Free)

資料表與資源

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