K4AAG165WA-BCPB vs K4A8G165WC-BCPB Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci K4AAG165WA-BCPB disebabkan oleh Samsung Electronics dan K4A8G165WC-BCPB disebabkan oleh Samsung Electronics. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Samsung Electronics
K4AAG165WA-BCPB - 16Gb DDR4 SDRAM 3200Mbps 1.2V | Samsung
K4AAG165WA-BCPB ✓ AktifPengandingan Spesifikasi
| Parametr | K4AAG165WA-BCPB | K4A8G165WC-BCPB |
|---|---|---|
| Merek | Samsung Electronics | Samsung Electronics |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Jenis Ingatan | Volatile DRAM (DDR4 SDRAM) | DDR4 SDRAM (volatile DRAM) |
| Technology | DDR4 | — |
| Density | 16 Gb | — |
| Organisasi | 1G x 16 | — |
| Kadar Data | 3200 Mbps | DDR4-2133 (2133 Mbps/pin) |
| Supply Voltage (VDD) | 1.2 V | — |
| Interface Voltage (VDDQ) | 1.2 V | — |
| Kemasan | FBGA-96 | 96-ball FBGA (TFBGA) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Suhu Operasi | [DATA_NEEDED: operating temperature for BCPB grade] | 0C to +95C |
| Memory Format | DRAM | — |
| Packaging | Tray | — |
| Product Status | Active | — |
| Power Consumption | 25% lower than DDR3 (per Samsung DDR4 family) | — |
| Bank Group Architecture | Yes (DDR4 internal bank groups) | — |
| On-Die Termination (ODT) | Yes | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Max Capacity Family | Up to 32GB component (Samsung DDR4 family) | — |
| Saiz Ingatan | — | 8 Gb |
| Memory Organization | — | 512M x 16 |
| Tegangan Pemberi Arus | — | 1.2 V |
| Operating Voltage Range | — | 1.14 V to 1.26 V |
| Antaramuka | — | DDR4 (16-bit data bus) |
| Die Generation | — | C-die (1Y nm class) |
| Ciri-ciri | — | Auto precharge, asynchronous reset, CRC, ZQ calibration, dynamic ODT, data mask |
| Termination | — | On-die termination (ODT), dynamic |
| Aras MSL | — | [DATA_NEEDED: MSL Level] |
| Standard | — | JEDEC DDR4 SDRAM |