K4B4G1646 vs K4B4G1646E-BYK000 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci K4B4G1646 disebabkan oleh Samsung Electronics dan K4B4G1646E-BYK000 disebabkan oleh Samsung Electronics. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | K4B4G1646 | K4B4G1646E-BYK000 |
|---|---|---|
| Merek | Samsung Electronics | Samsung Electronics |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Jenis Ingatan | DDR3 SDRAM | DDR3L SDRAM |
| Saiz Ingatan | 4 Gbit | 4 Gbit |
| Organisasi | 256M x 16 | 256M x 16 |
| Antaramuka | Parallel | Parallel |
| Max Data Rate | Up to 2133 Mbps (grade dependent) | — |
| Clock Frequency Range | 800 MHz to 2133 Mbps (grade dependent) | — |
| Tegangan Pemberi Arus | 1.5 V (DDR3L variants 1.35 V) | — |
| Kemasan | 96-FBGA | 96-FBGA (BYK) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Suhu Operasi | 0C to +95C | [DATA_NEEDED: operating temperature range] |
| On-Chip Termination (ODT) | Dynamic ODT | — |
| ZQ Calibration | Yes | — |
| Auto Precharge | Yes | — |
| Asynchronous Reset | Yes | — |
| Data Mask Function | Yes | — |
| Die Revisions | B-die, D-die, Q-die (DDR3L) | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Aras MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Speed Grade | — | DDR3-1600 (1.25 ns clock cycle) |
| Clock Frequency | — | 800 MHz |
| CAS Latency (CL) | — | [DATA_NEEDED: CAS latency - 1.25 ns CL grade indicates CL11 but not explicitly stated in provided data] |
| Supply Voltage (VDD) | — | 1.35 V (DDR3L), 1.5 V compatible (DDR3) |
| Number of Banks | — | [DATA_NEEDED: bank count] |
| Die Process | — | Samsung E-die |
| Ciri-ciri | — | Auto precharge, asynchronous reset, ZQ calibration, dynamic on-chip termination, data mask |
| Access Time | — | 1.25 ns |