M1AFS1500-FG676 vs M1AFS1500-2FG676I Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci M1AFS1500-FG676 disebabkan oleh Microchip Technology dan M1AFS1500-2FG676I disebabkan oleh Microchip Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Microchip Technology
M1AFS1500-FG676 - 1.5M Gate Fusion FPGA, 252 I/O | Microchip
M1AFS1500-FG676 ✓ AktifMicrochip Technology
M1AFS1500-2FG676I - 1.5M-Gate Fusion FPGA, FBGA-676 | Microchip
M1AFS1500-2FG676I ✓ AktifPengandingan Spesifikasi
| Parametr | M1AFS1500-FG676 | M1AFS1500-2FG676I |
|---|---|---|
| Merek | Microchip Technology | Microchip Technology |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Manufacturer | Microchip Technology (Microsemi) | — |
| Series | M1AFS1500 (Fusion) | — |
| Logic Cells | 38400 | — |
| Equivalent Gates | 1500000 | — |
| Number of I/O | 252 | — |
| Kemasan / Case | 676-Ball FBGA (FG676) | — |
| Tegangan Pemberi Arus Operasi | 1.5 V | — |
| Supply Voltage Range | 1.425 V to 1.575 V | — |
| Process Technology | 130 nm flash CMOS | 130 nm CMOS |
| Configuration Type | Flash-based (instant-on) | — |
| Frekuensi Klock Maksimum | 350 MHz | — |
| Security | 128-bit flash lock, AES decryption | — |
| Gaya Pemasangan | SMD/SMT | — |
| Minimum Operating Temperature | 0 C | — |
| Maximum Operating Temperature | +70 C | — |
| Packaging | Tray | — |
| Status RoHS | [DATA_NEEDED: RoHS compliance status] | RoHS Non-Compliant (contains lead) |
| Family | — | Fusion (Mixed-Signal Flash FPGA) |
| System Gates | — | 1.5 M |
| Core Supply Voltage | — | 1.5 V |
| Speed Grade | — | 2 |
| Kemasan | — | 676-ball FBGA (FG676) |
| Jenis Pemasangan | — | Surface Mount |
| Configuration Memory | — | On-chip flash (non-volatile, instant-on) |
| Gambaran Suhu Operasi | — | Industrial (I suffix) -40C to +100C |
| Embedded Analog Features | — | On-chip ADC, clock conditioning circuit (CCC), power-on reset |
| External Configuration Device | — | Not required |
| Lead Free Status | — | Contains Lead |
| Packaging Method | — | Tray |
| Number of User I/O | — | [DATA_NEEDED: Number of User I/O] |
| Embedded SRAM | — | [DATA_NEEDED: Embedded SRAM capacity] |
| DLL/PLL Blocks | — | [DATA_NEEDED: Number of CCC blocks] |