M1AFS1500-FG676 vs M1AFS1500-2FG676I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng M1AFS1500-FG676 sa pamamagitan ng Microchip Technology at M1AFS1500-2FG676I sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
M1AFS1500-FG676 - 1.5M Gate Fusion FPGA, 252 I/O | Microchip
M1AFS1500-FG676 ✓ NakahandaMicrochip Technology
M1AFS1500-2FG676I - 1.5M-Gate Fusion FPGA, FBGA-676 | Microchip
M1AFS1500-2FG676I ✓ NakahandaPagsanggunian na paghahambing
| Parametro | M1AFS1500-FG676 | M1AFS1500-2FG676I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Manufacturer | Microchip Technology (Microsemi) | — |
| Series | M1AFS1500 (Fusion) | — |
| Logic Cells | 38400 | — |
| Equivalent Gates | 1500000 | — |
| Number of I/O | 252 | — |
| Packhaging / Kaso | 676-Ball FBGA (FG676) | — |
| Supply Voltage na Operasyon | 1.5 V | — |
| Supply Voltage Range | 1.425 V to 1.575 V | — |
| Process Technology | 130 nm flash CMOS | 130 nm CMOS |
| Configuration Type | Flash-based (instant-on) | — |
| Maksimum na Taktiko ng Oras | 350 MHz | — |
| Security | 128-bit flash lock, AES decryption | — |
| Style ng Pagpapasok | SMD/SMT | — |
| Minimum Operating Temperature | 0 C | — |
| Maximum Operating Temperature | +70 C | — |
| Packaging | Tray | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance status] | RoHS Non-Compliant (contains lead) |
| Family | — | Fusion (Mixed-Signal Flash FPGA) |
| System Gates | — | 1.5 M |
| Core Supply Voltage | — | 1.5 V |
| Speed Grade | — | 2 |
| Packhaging | — | 676-ball FBGA (FG676) |
| Uri ng Pagpapasok | — | Surface Mount |
| Configuration Memory | — | On-chip flash (non-volatile, instant-on) |
| Hanay ng Temperature na Operasyon | — | Industrial (I suffix) -40C to +100C |
| Embedded Analog Features | — | On-chip ADC, clock conditioning circuit (CCC), power-on reset |
| External Configuration Device | — | Not required |
| Lead Free Status | — | Contains Lead |
| Packaging Method | — | Tray |
| Number of User I/O | — | [DATA_NEEDED: Number of User I/O] |
| Embedded SRAM | — | [DATA_NEEDED: Embedded SRAM capacity] |
| DLL/PLL Blocks | — | [DATA_NEEDED: Number of CCC blocks] |