MC9S08DN60ACLH vs MC9S08DV60AMLH Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MC9S08DN60ACLH disebabkan oleh NXP Semiconductors dan MC9S08DV60AMLH disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | MC9S08DN60ACLH | MC9S08DV60AMLH |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | Aktif |
| Core | HCS08 (S08 core) | — |
| Lebar Bus Data | 8 bit | — |
| CPU Frequency | 40 MHz | — |
| Bus Frequency | 20 MHz | — |
| Program Memory (Flash) | 60 KB (60K x 8) | — |
| RAM Size | 2 KB (2K x 8) | 3K x 8 |
| EEPROM | Embedded (size [DATA_NEEDED: EEPROM size]) | — |
| Number of I/O | 53 | 53 |
| Kemasan / Case | 64-LQFP (10x10 mm) | 64-LQFP (10x10 mm) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| ADC | 16-channel, 12-bit, 2.5 us conversion | — |
| Communication Interfaces | CAN 2.0A/B, USB 2.0 FS, SCI, SPI, I2C | — |
| Oscillator Type | External | External |
| Interrupt Sources | Up to 32 | — |
| Suhu Operasi | -40C to +85C [DATA_NEEDED: confirm automotive grade range] | — |
| Packaging | Tray | Tray |
| Status RoHS | Compliant | — |
| Instruction Set | HC08 + BGND instruction | HC08 with added BGND instruction |
| On-Chip Debug | BDM (Background Debug Mode) | — |
| Core Processor | — | S08 (HCS08), 8-bit |
| Core Size | — | 8-Bit |
| Speed | — | 40MHz CPU (20MHz bus) |
| Program Memory Size | — | 60KB (60K x 8) |
| Program Memory Type | — | FLASH |
| Input-Only Pins | — | 1 |
| ADC Resolution | — | 12-bit |
| ADC Channels | — | 16 |
| ADC Conversion Time | — | 2.5 us |
| Connectivity | — | CAN (MSCAN), LIN master |
| Interrupt/Reset Sources | — | Up to 32 |
| Tegangan Pemberi Arus | — | 3.3V/5V |