MC9S08DN60ACLH vs MC9S08DV60AMLH 比較

詳細並排比較 MC9S08DN60ACLH 由 NXP Semiconductors 與 MC9S08DV60AMLH 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MC9S08DN60ACLH MC9S08DN60ACLH - 8-bit S08 60KB Flash MCU, 40MHz, CAN | NXP

MC9S08DN60ACLH - 8-bit S08 60KB Flash MCU, 40MHz, CAN | NXP

MC9S08DN60ACLH Nrnd
NXP Semiconductors
MC9S08DV60AMLH MC9S08DV60AMLH - 8-bit MCU 60KB Flash 40MHz CAN LIN | NXP

MC9S08DV60AMLH - 8-bit MCU 60KB Flash 40MHz CAN LIN | NXP

MC9S08DV60AMLH ✓ 啟用中

規格比較

參數 MC9S08DN60ACLH MC9S08DV60AMLH
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 NRND 啟用中
Core HCS08 (S08 core) —
資料匯流排寬度 8 bit —
CPU Frequency 40 MHz —
Bus Frequency 20 MHz —
Program Memory (Flash) 60 KB (60K x 8) —
RAM Size 2 KB (2K x 8) 3K x 8
EEPROM Embedded (size [DATA_NEEDED: EEPROM size]) —
Number of I/O 53 53
封裝 / 外殼 64-LQFP (10x10 mm) 64-LQFP (10x10 mm)
安裝類型 Surface Mount Surface Mount
ADC 16-channel, 12-bit, 2.5 us conversion —
Communication Interfaces CAN 2.0A/B, USB 2.0 FS, SCI, SPI, I2C —
Oscillator Type External External
Interrupt Sources Up to 32 —
工作溫度 -40C to +85C [DATA_NEEDED: confirm automotive grade range] —
Packaging Tray Tray
RoHS 狀態 Compliant —
Instruction Set HC08 + BGND instruction HC08 with added BGND instruction
On-Chip Debug BDM (Background Debug Mode) —
Core Processor — S08 (HCS08), 8-bit
Core Size — 8-Bit
Speed — 40MHz CPU (20MHz bus)
Program Memory Size — 60KB (60K x 8)
Program Memory Type — FLASH
Input-Only Pins — 1
ADC Resolution — 12-bit
ADC Channels — 16
ADC Conversion Time — 2.5 us
Connectivity — CAN (MSCAN), LIN master
Interrupt/Reset Sources — Up to 32
供應電壓 — 3.3V/5V

資料表與資源

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