MC9S12DG256MFUE vs MC9S12DT256MPVE Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MC9S12DG256MFUE disebabkan oleh NXP Semiconductors dan MC9S12DT256MPVE disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MC9S12DG256MFUE - 16-bit HCS12 MCU, 256KB Flash, 80-QFP | NXP
MC9S12DG256MFUE NrndNXP Semiconductors
MC9S12DT256MPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP
MC9S12DT256MPVE NrndPengandingan Spesifikasi
| Parametr | MC9S12DG256MFUE | MC9S12DT256MPVE |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | NRND |
| Core | HCS12 (16-bit CISC) | HCS12 (16-bit CISC) |
| Program Memory | 256 KB Flash | — |
| RAM | 12 KB | 12 KB |
| EEPROM | 4 KB | 4 KB |
| Maximum CPU Frequency | 25 MHz | 25 MHz |
| Tegangan Pemberi Arus | 2.35 V to 2.75 V (5 V core) [DATA_NEEDED: full operating range incl. I/O] | 2.35 V to 2.75 V (regulated core) |
| I/O Pins | 59 | 91 |
| ADC | 8-channel, 10-bit | 2 x 10-bit, 8 channels each (16 channels total) |
| Timer | 8-channel Enhanced Capture Timer | — |
| Communication | 2x SCI, 2x SPI, I2C, CAN 2.0 | — |
| Kemasan | 80-LQFP (QFP-80), 14x14 mm | 112-LQFP (20x20 mm) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Suhu Operasi | -40C to +125C (AEC-Q100) | -40C to +125C (automotive grade) |
| AEC-Q100 Grade | Qualified | — |
| Status RoHS | Compliant | Compliant |
| Program Memory (Flash) | — | 256 KB |
| Lebar Bus Data | — | 16-bit |
| Timers | — | 8-channel Enhanced Capture Timer (ECT) |
| Communication Interfaces | — | 2 x SCI (UART), 2 x SPI, 1 x I2C, 1 x CAN (MSCAN 2.0A/B) |
| Debug Interface | — | Background Debug Mode (BDM) + JTAG |
| Status Lingkungan Hidup | — | NRND (Not Recommended for New Designs) |