MC9S12DG256MFUE vs MC9S12DT256MPVE Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MC9S12DG256MFUE sa pamamagitan ng NXP Semiconductors at MC9S12DT256MPVE sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MC9S12DG256MFUE - 16-bit HCS12 MCU, 256KB Flash, 80-QFP | NXP
MC9S12DG256MFUE NrndNXP Semiconductors
MC9S12DT256MPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP
MC9S12DT256MPVE NrndPagsanggunian na paghahambing
| Parametro | MC9S12DG256MFUE | MC9S12DT256MPVE |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | NRND | NRND |
| Core | HCS12 (16-bit CISC) | HCS12 (16-bit CISC) |
| Program Memory | 256 KB Flash | — |
| RAM | 12 KB | 12 KB |
| EEPROM | 4 KB | 4 KB |
| Maximum CPU Frequency | 25 MHz | 25 MHz |
| Volte ng Pagbibigay | 2.35 V to 2.75 V (5 V core) [DATA_NEEDED: full operating range incl. I/O] | 2.35 V to 2.75 V (regulated core) |
| I/O Pins | 59 | 91 |
| ADC | 8-channel, 10-bit | 2 x 10-bit, 8 channels each (16 channels total) |
| Timer | 8-channel Enhanced Capture Timer | — |
| Communication | 2x SCI, 2x SPI, I2C, CAN 2.0 | — |
| Packhaging | 80-LQFP (QFP-80), 14x14 mm | 112-LQFP (20x20 mm) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | -40C to +125C (AEC-Q100) | -40C to +125C (automotive grade) |
| AEC-Q100 Grade | Qualified | — |
| Tindminan RoHS | Compliant | Compliant |
| Program Memory (Flash) | — | 256 KB |
| Width ng Data Bus | — | 16-bit |
| Timers | — | 8-channel Enhanced Capture Timer (ECT) |
| Communication Interfaces | — | 2 x SCI (UART), 2 x SPI, 1 x I2C, 1 x CAN (MSCAN 2.0A/B) |
| Debug Interface | — | Background Debug Mode (BDM) + JTAG |
| Katayuan ng Lifecycle | — | NRND (Not Recommended for New Designs) |