MPC855TZQ50D4 vs MPC860DEZQ50D4 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MPC855TZQ50D4 disebabkan oleh NXP Semiconductors dan MPC860DEZQ50D4 disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | MPC855TZQ50D4 | MPC860DEZQ50D4 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Obsolete | NRND |
| Manufacturer | NXP Semiconductors (formerly Freescale, Motorola) | — |
| Series | PowerQUICC MPC8xx | — |
| Core Architecture | 32-bit Power Architecture | Power Architecture (embedded) |
| Core Frequency | 50 MHz | 50 MHz |
| Number of Cores | 1 | — |
| Communications Processor Module (CPM) | Yes (RISC-based offload engine) | — |
| Ethernet Support | 10/100 Mbps Fast Ethernet MAC | — |
| ATM Support | Yes (ATM SAR) | — |
| HDLC/SDLC Support | Yes | — |
| PCMCIA Interface | Yes | Yes |
| Instruction Cache | 4 KB | — |
| Data Cache | 4 KB | — |
| MMU | Yes | — |
| Kemasan | 357-ball PBGA (25 x 25 mm) | 357-Ball PBGA (25x25 mm) |
| Suhu Operasi | 0C to +95C | 0 C to +95 C |
| Process Technology | 0.32 um CMOS (per FindIC reference data) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Status RoHS | [DATA_NEEDED: RoHS status] | Contains Lead (legacy BGA) |
| Tegangan Pemberi Arus | [DATA_NEEDED: core/IO voltage values] | — |
| Processor Type | — | MPC8xx PowerQUICC, 32-bit |
| Communications Processor Module | — | CPM with HDLC, Ethernet, PCMCIA, SCC |
| Ethernet MAC | — | 10/100 Mbps integrated |
| HDLC/SDLC Channels | — | Yes (multi-channel) |
| Supply Voltage (I/O) | — | 3.3 V |
| Lead-Free Status | — | Contains Lead |
| Packaging | — | Tray |
| Sub-Brand Heritage | — | Freescale / NXP PowerQUICC |